TPS24711DGSR【PDF 2/34 页】IC CTRLR HOT SWAP 2.5-18V 10MSOP

TPS24710,TPS24711

TPS24712,TPS24713

SLVSAL2E JANUARY 2011REVISED NOVEMBER 2013

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

DEVICE INFORMATION

T

A

PACKAGE

PART NUMBER

(1)

FUNCTION

FLT, PG POLARITY

MARKING

TPS24710

Latched

24710

Active Low

TPS24711

Retry

24711

40篊 to 85篊

MSOP-10

TPS24712

Latched

24712

Active High

TPS24713

Retry

24713

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range, all voltages referred to GND (unless otherwise noted)

VALUE

UNIT

EN, FLT

(1)(2)

, FLTb

(1)(3)

, GATE, OUT, PG

(1)(2)

, PGb

(1)(3)

, SENSE, VCC

0.3 to 30

PROG

(1)

0.3 to 0.3

Input voltage range

V

SENSE to VCC

0.3 to 0.3

TIMER

0.3 to 5

Sink current

FLT, PG, FLTb, PGb

5

mA

Source current

PROG

Internally limited

All pins except PG and PGb

2

Human-body model

ESD rating

PG, PGb

0.5

kV

Charged-device model

0.5

Temperature

Maximum junction, T

J

Internally limited

癈

(1) Do not apply voltages directly to these pins.

(2) for TPS24712/13

(3) for TPS24710/11

THERMAL INFORMATION

TPS24710/11/12/13

THERMAL METRIC

(1)

UNIT

MSOP (10) PINS

?/DIV>

JA

Junction-to-ambient thermal resistance

166.5

癈/W

?/DIV>

JCtop

Junction-to-case (top) thermal resistance

41.8

癈/W

?/DIV>

JB

Junction-to-board thermal resistance

86.1

癈/W

?/DIV>

JT

Junction-to-top characterization parameter

1.5

癈/W

?/DIV>

JB

Junction-to-board characterization parameter

84.7

癈/W

?/DIV>

JCbot

Junction-to-case (bottom) thermal resistance

n/a

癈/W

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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